LASER SCRIBING of ceramic material

Laser scribing involves the realization of a 20 to 50 µm thick groove in ceramic material. Afterwards the material can be broken along this groove without any difficulty. Laser scribing guarantees a cleanly separation with a high level of quality and accuracy.

In contrast to mechanical processing, this method leaves no micro-fractures in the material. High scribing speeds can be reached.

Example of application

  • Printed circuits

Workable materials

Ceramic, aluminium oxyde (Al2O3)

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